| 摘要 |
PURPOSE:To enable a metal film of insulation substrate and a lead wire to be efficiently soldered at only a required area by removing oxidation film of metal film by surface opening operation of flux and by soaking it into an inactive solution which was maintained at a high temperature. CONSTITUTION:By coating the surface of a lead wire 6 with solder by plating, etc., and by pressing down the tip of a tip part 6a' by inserting it into a penetration hole 5b, a collar part 6a which is larger than the penetration hole 5b is produced, flux is applied to a metal film 5a and the collar part 6a of the lead wire 6, an oxidation film, etc., of the metal film 5a is removed by surface cleaning operation of flux, and it is soaked into an inactive solution with a high boiling point than that of solder which is used for solder coating of the lead wire 6. If the coated solder melts, thus resulting in solder wetting to the metal film 5a and it is taken out of the inactive solution tub, the melting solder becomes solid to solder the collar part 6a of the lead wire 6 and the metal film 5a. |
