| 摘要 |
A wafer annealing furnace is provided to avoid or suppress generation of particles on a product wafer by suppressing or removing the impurities on the surface of a dummy wafer. A main heat process part(110) performs a heat process on product wafers. A sub heat process part(130) performs a preliminary heat process for removing impurities from dummy wafers introduced together with the product wafers before the dummy wafers are mounted on the main heat process part. A wafer mounting part(150) transfers the wafer to the main heat process part and the sub heat process part. The sub heat process part can be installed inside or outside the main heat process part.
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