TWO LAYERED COPPER-CLAD LAMINATE AND MANUFACTURING METHOD THEREFOR, FLEXIBLE WIRING BOARD USING THE SAME AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a two layered copper-clad laminate used for manufacturing a flexible wiring board by a semi-additive method, having no generation of wrinkle and high dimensional stability and reduced warpage during and after processing the flexible wiring board and a manufacturing method therefor, and the flexible wiring board using the two layered copper-clad laminate.SOLUTION: There is provide two layered copper-clad laminate having a base metal layer and a copper layer laminated on at least one surface of a polyimide film containing an imide bond consisting aromatic diamine and 3,3'-4,4'-diphenyl tetracarboxylic acid dianhydride, thickness of the copper layer of 0.1 μm to 1 μm, dimension after etching to dimension before etching of the two layered copper-clad laminate in a longitudinal (MD) direction of the two layered copper-clad laminate expresses dimensional change expanding in a range of 0.000 to 0.030% and dimension after a heat treatment after etching expresses dimension change shrinking in a range of 0.000 to 0.020% or expanding in a range of 0.000% to 0.006% to dimension before etching.SELECTED DRAWING: Figure 1