| 摘要 |
<p>The invention relates to a low temperature sealing glass composite comprising: a first component consisting essentially of a glass matrix selected from the group consisting essentially of lead borate, leadzinc borate, lead borosilicate, or lead-zinc borosilicate, the glass matrix having a coefficient of thermal expansion in excess of about 80 x 10-7 in/in/.degree.C (from ambient to glass transition temperature), and a second component consisting essentially of an effective amount up to about 30 wt. % of a particulate additive having limited solubility in the glass matrix to increase the effective coefficient of thermal expansion of the resulting sealing glass composite. The sealing composite of the invention is particularly useful as a semiconductor package sealant.</p> |
