| 摘要 |
PURPOSE:To stabilize plating work over a long period by adding an oxidizing compd. to a standard bath for electroless copper plating in a specified ratio. CONSTITUTION:A compd. having oxidizing action is added to essential components forming a standard bath for electroless copper plating within the range of <10%. H2O2, HClO or NaClO is useful as the compd. having oxidizing action and the compd. is generally used by about 1-100mg/l. By the resulting compsn. of the plating bath, a plated product having a fine surface is obtd. without causing abnormal deposition. |
