发明名称 MULTILAYER CERAMIC WIRING BOARD AND MANUFACTURE THEREOF
摘要 PURPOSE:To obtain a multilayer ceramic wiring board whose wiring parts can be transferred into a superconducting state at the temperature higher than the temperature of liquid nitrogen by a method wherein the wiring parts in the multilayer ceramic wiring board are made of material whose main component is dysposium-barium-copper oxide. CONSTITUTION:Wiring parts in a multilayer ceramic wiring board are made of material whose main component is dysprosium-barium-copper oxide and the wiring parts are formed inside insulating ceramics. As the insulating ceramic material, mixture of quartz glass powder and boron silicate glass powder is employed. A green sheet with a small and uniform thickness is made of the insulating ceramic material and a required conductor pattern is formed on the green sheet with conductive paste. The conductive paste is obtained by kneading disprosium oxide (Dy2O3), barium carbonate (BaCO3) and copper oxide (CuO) with organic solvents. Then the insulator and the conductor are baked together. The wiring formed like this is transferred into a superconducting state at about 90K which is higher than the temperature of liquid nitrogen and shows zero electric resistance.
申请公布号 JPS6437090(A) 申请公布日期 1989.02.07
申请号 JP19870192872 申请日期 1987.07.31
申请人 NEC CORP 发明人 SHIMADA YUZO;TABUCHI JUNJI;OCHI ATSUSHI
分类号 H05K3/46;H01L23/52;H01L23/538;H01L39/06 主分类号 H05K3/46
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