| 摘要 |
PURPOSE:To enable the employment of a copper foil and a one-side copper-clad laminate as a conductive substrate for an outer layer and to prevent the attachment of a prepreg to guide pins caused by a resin flow by forming a positioning through-hole only in a predetermined position of a two-side printed board for inner layer. CONSTITUTION:The size of two-side printed boards 5 and 6 for inner layer are determined to be larger than that of other components and guiding through- holes 9 are arranged in these larger parts. A guide pin 2 which is planted in a bottom force 1a out of two opposing forces, is brought in alignment with said guiding through-hole 9, thereby contriving positioning and fixation of that position. Then, the substrate is held between the bottom force 1a and the top force 1b and is subjected to pressing and heating for bonding it into one body. Further, a peripheral bur around the unitarily bonded substrate by pressing and heating is cut and a circuit pattern 10 is formed on outer one-side copper- clad laminate substrates 3 and 7. Then, holes for attaching a circuit device are opened. Thus, a 6-layer printed wiring board can be formed. |
