| 摘要 |
<p>PURPOSE:To obtain the title composition which has excellent heat resistance, electrical properties, and adhesiveness to an electroless plating film and enables high-density and high-accuracy wiring, by dispersing two kinds of specified fillers in an uncured heat-resistant resin liquid. CONSTITUTION:A matrix (A) comprising an uncured heat-resistant resin liquid (e.g., an epoxy resin), dissolved in a solvent (e.g., dimethylformamide) if required, is mixed with 5-350pts.wt., based on 100pts.wt. resin solids of component A, mixture (B) of a filler (a) comprising a fine heat-resistant resin powder (e.g., a fine epoxy resin powder) of a mean particle diameter of 5muom or less, cured in advance and having a solubility in an oxidizing agent (e.g., chromic acid) higher than that of the cured component A with a filler (b) comprising a fine heat-resistance resin powder (e.g., a fine benzoguanamine resin powder) cured in advance and/or a fine heat-resistant inorganic powder (e.g., a fine silica powder) of a mean particle diameter of 5mum or less and having a solubility in an oxidizing agent lower than that of the cured component A in a ratio of (a) to (b) of 1-20:20-1, thus forming a dispersion.</p> |
