| 摘要 |
PURPOSE:To realize a small-sized and highly integrated semiconductor chip by a method wherein, when a mutual connection of signal input/output terminals covers two or more logic circuit block rows, the mutual connection is executed by using the signal input/output terminals which are defined on two sides along an interlinking direction. CONSTITUTION:Logic circuit blocks 3 contain the following: first signal input/ output terminals 5 installed near the center of a block on a straight line parallel to a side along a directly connecting direction of a row; second signal input/ output terminals individually installed on two sides in an interlinking direction of rows. The corresponding signal input/output terminals 5 are connected by using metal wiring parts 7 as first wiring parts installed on the logic circuit block row to which the logic circuit block belongs; the corresponding signal input/output terminals 6 are connected by using metal wiring parts 8 in a transverse direction as second wiring parts, metal wiring parts 9 in a longitudinal direction and metal wiring parts 10 in a longitudinal direction which cross the logic circuit block row, all installed in wiring part regions 4-1-4-3. |
