发明名称 MANUFACTURE OF CHIP RESISTOR
摘要 <p>PURPOSE:To form a substrate, contact electrodes, lead electrodes and a resistor by one baking process simultaneously by a method wherein resistor materials to be resistors are printed between respective pairs of electrode materials on a ceramic green sheet before the baking process and then a process in which the ceramic green sheet is divided is provided. CONSTITUTION:First, a plate-shape ceramic green sheet 30 to be a substrate is prepared and electrode materials 32 are printed on its upper surface so as to form a plurality of pairs of contact electrodes. The resistor materials 34 are printed between the electrode materials 32. The sheet 30 is divided into chips 36. Electrode materials 38 which are extended from the electrodes 32 and are to be lead electrodes are printed on the end surfaces of the chip 36. The chip 36 is baked. With this constitution, the sheet 30, the electrode materials 32 and 38 and the resistor material 34 are baked simultaneously. As the sheet 30 is divided into the chips 36 before baking, the smooth end surfaces of the chip can be obtained and a barrel treatment is not necessary.</p>
申请公布号 JPS6424401(A) 申请公布日期 1989.01.26
申请号 JP19870181872 申请日期 1987.07.20
申请人 MURATA MFG CO LTD 发明人 KOBAYASHI TAKASHI;TANI KOJI;SUGO KIMIHIDE;KASATSUGU TORU
分类号 H01C7/00;H01C17/06;H01C17/28 主分类号 H01C7/00
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