发明名称 |
Process for treating copper-nickel alloys for use in brazed assemblies and product |
摘要 |
The present invention relates to a process for maintaining the fine grain size of and providing excellent bend formability, hot ductility and strength properties to a copper-nickel-manganese alloy to be exposed to elevated temperatures. The process of the present invention includes a final cold working step during which the material to be fabricated into a desired article and/or exposed to the elevated temperatures has its thickness reduced by about 4% to about 30%, preferably from about 5% to about 25%. The alloys described herein have particular utility in brazed articles or assemblies.
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申请公布号 |
US4799973(A) |
申请公布日期 |
1989.01.24 |
申请号 |
US19840596182 |
申请日期 |
1984.04.02 |
申请人 |
OLIN CORPORATION |
发明人 |
MAHULIKAR, DEEPAK;SHAPIRO, EUGENE |
分类号 |
C22F1/08;(IPC1-7):C22F1/08;B32B15/20 |
主分类号 |
C22F1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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