发明名称 BONDING PB ALLOY WIRE FOR SUPERCONDUCTOR DEVICE & SUPERCONDUCTOR DEVICE
摘要 A pb alloy wire which is used for electrically connecting (1) a superconductor chip and an external lead, or (2) one superconductor chip and another superconductor chip with each other through a wire bonding process and more particularly through a nail head bonding process or a wedge bonding process into a thin wire shape using a liquid quenching process. The alloy, which has Pb as its main constituent may include at least one of Cu, Ge, Ga, Se, Ag, In, Sn, Sb, Te, Au, Te, Bi, Pd and Pt.
申请公布号 GB8828875(D0) 申请公布日期 1989.01.18
申请号 GB19880028875 申请日期 1988.12.09
申请人 TANAKA DENSHI KOGYO KK 发明人
分类号 H01L21/00;H01L21/60;H01L39/02;H01R4/68 主分类号 H01L21/00
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