发明名称 PHOTOSENSITIVE COMPOSITION
摘要 PURPOSE:To enable the polyimidation of the titled composition by a relatively low temperature treatment by incorporating a specified polymer in the titled composition. CONSTITUTION:The titled composition contains the polymer which has a repeating unit shown by formula I and can be converted to a polymer having >=300 deg.C a temperature of commercing the thermogravimetric reduction by thermally treating, and a photopolymerization initiator. In the formula, X is a four valent carbon ring or heterocyclic ring group, Y is a two valent carbon ring or heterocyclic ring group, Z shows a binding between groups X and Y, and consists of 90-10mol.% a group shown by formula II, 90-40mol.% a group shown by formula III, and 10-60mol.% a group shown by formula IV, R is a group having a reactive carbon-carbon double bond. A cover layer which does not cause layer-to-layer peeling and does not produce a blister, even in case of a fluxing treatment, is obtd. by forming for example, a dry film from the titled composition, and then, laminating said films on a substrate plate, followed by patterning it, and then, by thermally treating the patterned film at a prescribed condition for example, 230 deg.C, for 1hr, in the atmosphere of nitrogen gas to convert said film to the polyimide pattern.
申请公布号 JPS642037(A) 申请公布日期 1989.01.06
申请号 JP19870156652 申请日期 1987.06.25
申请人 ASAHI CHEM IND CO LTD 发明人 YOKOTA KANICHI;AI HIDEO
分类号 C08G73/10;G03F7/038 主分类号 C08G73/10
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