发明名称 MANUFACTURE OF MULTILAYER SUBSTRATE
摘要 PURPOSE:To obtain a multilayer substrate having a high bonding strength by laminating heat resistant cloth impregnated and coated with resin composition which mainly contains unsaturated polyester containing as acid ingredients phthalic acid, nonwoven fabric and metal foil, forming a circuit substrate by a subtractive method, then bonding it to a metal plate, and curing it. CONSTITUTION:Heat resistance fiber is impregnated or coated with resin composition which contains unsaturated polymer containing as acid ingredients terephthalic acid and/or sophthalic acid, diarylterephthalate and polyisocyanate. A core material made of cloth or nonwoven fabric which contains as a main ingredient the heat resistant fiber and a metal foil are laminated. The composition is disposed in a B stage state, a circuit substrate is formed by a subtractive method, it is bonded to a metal plate or other circuit substrate, and then cured. Thus, a multilayer substrate having high bonding strength is obtained.
申请公布号 JPS63312833(A) 申请公布日期 1988.12.21
申请号 JP19870150693 申请日期 1987.06.16
申请人 OSAKA SODA CO LTD 发明人 SEN TSUNEO;MATSUMOTO MASAHIRO
分类号 B32B15/08;H05K3/46 主分类号 B32B15/08
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