发明名称 |
SOLDERABLE CONDUCTIVE COMPOSITIONS HAVING HIGH ADHESIVE STRENGTH |
摘要 |
<p>Patent Application of Frank St. John and Samson Shahbazi for SOLDERABLE CONDUCTIVE COMPOSTIONS HAVING HIGH ADHESIVE STRENGTH This invention provides conductive compositions that are directly solderable and that can be bonded directly to substrates. The compositions are made of silver exclusively in the form of flake and a resin system, said rosin system comprising phenolic rosin, acrylic resin, polyurethane resin, vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardener. By making a mixture of such a complex vehicle system a composition is produced that displays outstanding solderability and adhesion. Also provided is a method of making these compositions.</p> |
申请公布号 |
CA1246767(A) |
申请公布日期 |
1988.12.13 |
申请号 |
CA19850485269 |
申请日期 |
1985.06.26 |
申请人 |
ELECTRO MATERIALS CORP. OF AMERICA |
发明人 |
ST. JOHN, FRANK;SHAHBAZI, SAMSON |
分类号 |
H05K3/12;C08G59/00;C08G59/32;C08K3/08;C08L1/00;C08L27/00;C08L33/00;C08L33/02;C08L63/00;H01B1/00;H01B1/22;H05K1/09;(IPC1-7):H01B1/22 |
主分类号 |
H05K3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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