发明名称 INTEGRATED CIRCUIT SUBSTRATE
摘要 <p>PURPOSE:To decrease power supply wirings and external connecting terminals by arranging three or more of diaphragm type solenoids having the different number of turns onto a wiring substrate mutually adjacently, inputting an AC power to one diaphragm type solenoid and rectifying and smoothing voltage generated in other diaphragm type solenoids and supplying the inside of the wiring substrate with the voltage. CONSTITUTION:At least three diaphragm type solenoids 6, 9, 10 being mutually disposed onto a wiring substrate 1 adjacently and having the different number of turns, input terminals 5a, 5b being connected to ones of said diaphragm type solenoids and inputting an AC power from the outside, and a circuit being connected to other each diaphragm type solenoid, rectifying and smoothing voltage generated in the diaphragm type solenoids and supplying the inside of said wiring substrate with the voltage are provided. Thin-film solenoids as primary windings in six turns are formed by solenoid windings 6a-6g and each lower solenoid wiring, and thin-film solenoids in two turns and one turn are respectively shaped similarly as secondary windings by solenoid wirings 9a, 9b and 10. Diodes 14a, 14b and capacitors 15a, 15b are placed among specified wiring pads.</p>
申请公布号 JPS63302548(A) 申请公布日期 1988.12.09
申请号 JP19870137645 申请日期 1987.06.02
申请人 NEC CORP 发明人 INOUE TATSUO
分类号 H01L21/822;H01L23/538;H01L27/02;H01L27/04;H05K1/02;H05K1/16;H05K3/46 主分类号 H01L21/822
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