| 摘要 |
PURPOSE:To prevent the end of an insulating substrate from damaging by forming a magnetic sensor layer on the substrate and forming a protecting film on its end face. CONSTITUTION:A magnetic sensor layer 32, a conductive layer 33 and a lead terminal 34 are formed at a predetermined interval on an insulating substrate 13 before it is cut as a magnetic sensor chip. The layers, 32, 33 are formed by photoetching or the like, and the terminal 34 is soldered to the layer 33. Then, a plurality of grooves are formed on the substrate at a pitch of cutting the chip. Then, a protecting film forming agent such as silicon resin or epoxy resin is filled in the groove 15. In case of filling the agent, the periphery of the groove 15, the layers 32, 33 are coated with the agent 16. After the agent 16 is cured, it is transferred to the step of cutting the chip. Then, the substrate 13 is cut from its front surface toward the center of the bottom of the groove 15, stopped at the state that the substrate 13 is not completely cut, and the substrate 13 is then cut from its rear face side, thereby completely cutting its uncut section. |
