| 摘要 |
PURPOSE:To prevent damage of a semiconductor element and occurrence of electrical connection defect upon the mounting of a semiconductor element, by using a pressure welding method to obtain an electrical connection between metallic protruding parts of the semiconductor element and wiring parts of a wiring substrate and on the other hand by using an adhesive tape to fix the semiconductor element on the wiring substrate. CONSTITUTION:A flexible insulation tape 4 with an adhesive 3 is stuck on an upper surface of a semiconductor element 2 with protruding electrodes 1. Next the protruding electrodes 1 of the semiconductor element 2 are made to touch a conductor wiring 6 on a wiring substrate 7, and an internal press tool 8 is used to press and electrically connect the protruding electrode 1 and the conductor wiring 6. Next, an external press tool 9 is moved downward, and the flexible tape 4 is bent to wrap the semiconductor element 2. Further, a part of the tape 4 protruding beyond the substrate is cut and removed. At that time the adhesive 3 on the wiring 6 is extruded on the periphery of the wiring in the pressing process and the tape 4 is stuck on the substrate 7 by the adhesive. Accordingly the semiconductor element 2 is completely fixed on the substrate 7.
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