发明名称 MOLD ASSEMBLY FOR RESIN MOLDING
摘要 PURPOSE:Not to leave any gate trace on the surface of a product and to make it possible to injection-molding the product, by providing a tunnel gate in a slide core and a molten resin storing part being a little thicker than an ejecter pin at the place where the slide core is moved in the moving direction of a projected pin. CONSTITUTION:When the parting face of a mold starts to open a little, the apex part of a sprue runner 5 has been already pulled apart from the apex part of tunnel gate 7. Moreover, a movable side mold plate 2 and a fixed side mold plate 1 move in parallel, the sprue runner 5 starts to release the mold while being bent. When the mold is completely opened, the slidecore 3 has been stopped by bringing in contact with a slide core stopping plate 23. The relation between the diameter d1 and the diameter d2 of the resin storing part in the slide core is set in such a way that d2 is designed to be a little thicker than d1 in taking the processing accuracy and the assembling accuracy of the mold into consideration. When projecting action is completed, the tunnel gate 7 is released from the mold while being bent in the slide core 3.
申请公布号 JPS63295224(A) 申请公布日期 1988.12.01
申请号 JP19870132416 申请日期 1987.05.28
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKAMURA KOJI
分类号 B29C45/26;B29C45/27;B29C45/40 主分类号 B29C45/26
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