摘要 |
PURPOSE:To keep objects subjected to a heat treatment horizontal without falling off and vibration by providing a plurality of grooves into which the objects are partially inserted on pillars fitted between side plates. CONSTITUTION:The supporting part 4 of a boat for a heat treatment is constituted by pillars 10, 12, 14 and 16 fitted between side plates 6 and 8 with intervals smaller than a half of the whole circumference of a semiconductor wafer 2. Grooves 24 which hold the semiconductor wafers 2 are provided on the respective pillars 10-16 with a certain interval. The pillars 10 and 14 are provided at the positions higher than a horizontal line (l) passing through the center O of the wafer 2 by an angle - or + . With this constitution, a stress applied to the semiconductor wafer 2 can be suppressed and the deformation of the wafer 2 can be avoided and, moreover, vibration and falling-off at the time of transfer can be avoided. Further, by operating a protruding handle 5, the angle can be arbitrarily predetermined and the boat can be held vertically. |