| 摘要 |
PURPOSE:To simply constitute a surface-mounting package and to manufacture said package in a short time easily by a method wherein conductor pins are installed in a conductor-pin holding hole at an insulating board and in a through hole corresponding to the hole at a flexible board. CONSTITUTION:First through holes 12a and a second through hole 12b which are formed at a flexible board 12 connect a surface-side conductor circuit 13a and a rear-side conductor circuit 13b electrically at prescribed positions. The board 12 is wound on the circumference of a board 11 in such a way that the through holes 12a coincide with conductor-pin holding holes 11a at the insulating board 11; it is fixed to the board 11. Conductor pins 14 which are made conductive to the outside are inserted into the conductor-pin holding holes 11a and are fixed by solders 14b. By this setup, a surface-mounting package 10 can be formed in a short, time.
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