| 摘要 |
<p>PURPOSE:To make it possible to precisely separate chips from one another without applying excess pressing force on the part of a wafer by a method wherein the wafer is separated into respective chips and, after that, stuck on a tape by pressing a projected spherical surface, which is heated up to a predetermined temperature, through the tape against the rear surface of the wafer seated on a mat. CONSTITUTION:A half-cut wafer 3 is seated so as to face its surface, onto which chips are formed, to the top surface of a mat 2. Next, the ductility of a tape 8 is enhanced by bringing a projected spherical surface part 7, which is heated up to a predetermined temperature, into close contact with the tape 8. After the tape 8 is fixed to the rear surface of the wafer 3 under pressure by lowering the projected spherical part 7, the projected spherical surface part 7 is pressed to the rear surface of the wafer 3. The wafer 3, which is pressed by the projected spherical surface part 7, deforms spherically and projects downwards in the state where the wafer 3 is in contact with the rubber mat 2. Accordingly, pressures having same intensities are applied on respective chips formed on the wafer 3, resulting in developing no damage in the chips and allowing to precisely separate the chips.</p> |
