| 摘要 |
PURPOSE:To provide a polyfunctional epoxy resin containing a specific epoxy compound useful for insulating materials, sealants, molding materials, etc., which gives a cured product having a higher heat resistance compared with prior trifunctional epoxy resins. CONSTITUTION:This polyfunctional epoxy resin contains 40wt.% or more of epoxy compound of n>=1 in the formula I (wherein R is a hydrogen atom or a 10 or less C alkyl group; m is 1, 2 or 3; and n is 0 or a integer of 1-10). The above polyfunctional epoxy resin is obtained by reacting a phenol resin containing 30wt.% or more of polynuclear phenol compound of n>=1 in the formula II (wherein R, m and n are each as above) with an epihalide of the formula III (wherein X is a halogen atom) in the presence of a basic compound.
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