| 摘要 |
PURPOSE:To avoid the degradation of the cleanness of a working environment and improve a production efficiency by a method wherein the coating conditions of resist which is applied to a wafer are automatically predetermined before the wafer is brought into a resist coating process and the resist is applied to the wafer in accordance with the predetermined conditions. CONSTITUTION:When a wafer 1 is loaded onto an x-y table 7, light is applied to a wafer identification mark 1a by a lamp 8 and the reflected light is read by a mark reading head 9 and the reading result is transmitted to a mark data processing unit 10. The mark data processing unit 10 discriminates the data signal and transmits the discriminated data signal to a resist supply controller 11 and a driving controller 12 to control the supply of the resist and at the same time control the driving. As a type of resist, supplied quantity and the thickness of a resist coating film are selected automatically in accordance with the predetermined conditions by reading the identification mark of the wafer 1, the chances of operators to take part in the resist coating process are reduced so that the degradation of the cleanness of the environment can be avoided. |
