发明名称 SOLDER REMOVER
摘要 PURPOSE:To absorb the impact force of an electric contact and to improve the reliability in removing solders by equipping the solder sucking part of a main body removing the solder melted by a contact heat at the rear end of the contact head. CONSTITUTION:The heat source of a soldering iron is brought into contact with a contact head 1 and with the solder of an electric contact. At this time the impact at the time of touching the electric contact of the contact head 1 is released by a spring 3. When a solder is melted with the contact head 1 becomes at high temp., a stopper 11 is removed from a handle 10, then, flanges 8, 8a are pushed out to the right and left by the force of springs 7, 7a and a piston 5 is pulled by a wire 6 and a cylinder 4 is moved from one end of the contact head to the other. The air pressure inside the cylinder 4 becomes a negative pressure and with the flow of the outside air into the cylinder 4, the molten solder is blown off from the electric contact and sucked into the cylinder 4. The solder is thus removed easily and the impact force at contact can be reduced.
申请公布号 JPS63256269(A) 申请公布日期 1988.10.24
申请号 JP19870088663 申请日期 1987.04.13
申请人 MINO KAORU 发明人 MINO KAORU
分类号 B23K1/018;B23K3/00 主分类号 B23K1/018
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