| 摘要 |
PURPOSE:To improve the reliability of an electrical test by mounting a cap consisting of an insulating material softer than a semiconductor wafer at the tip of a height detecting probe detecting positioning at predetermined height on the semiconductor wafer of a testing probing card for the semiconductor wafer. CONSTITUTION:A stage 5 on which a semiconductor wafer 4 is placed is lifted, thus bringing electrical testing probes 2 and vertical needles 2A-1 for height detecting probes 2A into contact with the semiconductor wafer 4. When the semiconductor wafer 4 pushes up the vertical needles 2A-1, the contacts of the vertical needles 2A-1 and lateral needles 2A-2 are separated, thus detecting reaching to a prescribed position of the semiconductor wafer 4. Caps 6 consisting of ethylene tetrachloride, etc. are fitted at the tips brought into contact with the semiconductor wafer 4 of the vertical needles 2A-1, thus preventing the damaging of the surface of the semiconductor wafer 4. The noses of the caps 6, surfaces abutted against the semiconductor wafer 4, are rounded off so that stress does not concentrate to the semiconductor wafer 4.
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