| 摘要 |
<p>A thermal-image sensing device is manufactured with a 2-dimensional array of ferroelectric or pyroelectric infrared detector elements (38) mounted on a circuit substrate (1). The upper surface of the circuit substrate (1) is covered with a thick insulating layer (10) of plastics material in which a corresponding 2-dimensional array of bores (11) is formed. Each of the detector elements (38) is connected to a respective electrode (2) of the circuit substrate (1) by means of a metal coating over the wall of its respective bore (11) and over the respective electrode (2) of the circuit substrate (1). The invention permits a simplification in manufacture while forming a device structure with a high degree of ruggedness and good electrical and thermal insulation between the detector elements (38) and the circuit substrate (1). It also permits the detector element array to be formed in situ on the circuit substrate (1), for example by sawing grooves (36) through a metallised sheet (30,31,32) of the ferroelectric or pyroelectric material mounted on the metal-coated plastics material (10) and then providing top electrode connections (41) bridging the grooves (36).</p> |
