| 摘要 |
PURPOSE:To decrease the yield of dust due to friction and abrasion, by controlling the surface roughness of a silicon carbide material. CONSTITUTION:This semiconductor jig is a process pipe, a handle having a size and a configuration, which can be inserted into said process pipe, a jig for inputting and taking out said handle or a semiconductor mounting jig. The jig is constituted with a silicon carbide material having a part, whose surface roughness is Rmax<=15mum. In order to achieve Rmax<=15mum, it is necessary to polish each semiconductor jig with at least one kind of abrasive grain selected from diamond, silicon carbide, alumina, boron nitride and cerium oxide that have 100#. Thus the yield of dust can be suppressed for mechanical abrasion. Excellent effects in improvement of the yield in semiconductor manufacturing and improvement of characteristics can be obtained.
|
