| 摘要 |
PURPOSE:To make the resist film thickness of a wafer uniform by forming an exhaust path of a porous material, and providing the exhaust path so as to surround a motor for rotating the wafer in the center of the housing, thereby making the exhaust uniform and preventing the generation of heat by the motor. CONSTITUTION:A semiconductor wafer 13 is held by a chuck 12, and a resist 14 is dropped onto the central section thereof. The wafer 13 is rotated by motor 15 integrally with the chuck 12 to perform the resist coating of the wafer 13. An exhaust path 18 is made of a porous material, and an exhaust pipe 21 is connected to a part led out below a housing 11. Exhaust blowers are provided in the pipe 21, and the exhaust path 18 is provided so as to surround the motor 15, so that the motor 15 is cooled by the exhaust gas. Accordingly, the rotational irregularities of the motor 15 due to the generation of heat is prevented and simultaneously the exhaust is made uniform since it is performed at the central section. With this, the resist film thickness of the wafer can be made uniform.
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