| 摘要 |
PURPOSE:To obtain a high-sensitivity output by arranging a strain gauge which is incorporated in a bridge circuit on the opposite side from the depression part of a silicon chip which is divided by a groove. CONSTITUTION:The silicon chip 11 arranged on a mold substrate 14 is formed in matrix by cut grooves 8. Each sensor unit 10 of the chip 11 has a pressure reception button 19 in a recessed part 11A formed in the center of its pressure reception surface and also has the bridge circuit of a strain gauge 12 on the side of the substrate 14 corresponding to the recessed part 11A, and the gauge 12 contacts the substrate 14 through an elastic substrate 15. Then the chip 11 bends by pressure reception, and consequently the gauge 12 generates tensile stress and compressive stress, so that the high-sensitivity output is obtained.
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