发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要 PURPOSE:To obtain the titled composition, consisting of an epoxy resin, curing agent, specific butadiene-styrene copolymer and inorganic filler and having a low elastic modulus and thermal stress as well as high insulation resistance without fear of deteriorating the glass transition temperature. CONSTITUTION:The aimed composition consisting of (A) an epoxy resin (preferably novolak type epoxy resin), (B) a curing agent for the epoxy resin (preferably novolak type resin), (C) liquid butadiene-styrene copolymer having carboxyl groups at both terminals (preferably 10-25mol.% styrene content) and (D) an inorganic filler (preferably fused silica or crystalline silica).
申请公布号 JPS63207816(A) 申请公布日期 1988.08.29
申请号 JP19870039802 申请日期 1987.02.23
申请人 UBE IND LTD 发明人 ASHITAKA HIDETOMO;HAMAMOTO SHUNICHI;ENDO SHIGERU;MIWA YOSHIYUKI
分类号 C09K3/10;C08G59/00;C08G59/42;C08L63/00;H01L23/29;H01L23/31 主分类号 C09K3/10
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