| 摘要 |
PURPOSE:To obtain the titled molding material outstanding in low internal stress and moldability, for semiconductor sealing use, by incorporating an epoxy resin composition with each specified amount of spherical silica and silicone compound. CONSTITUTION:The objective molding material can be obtained by incorporating (A) an epoxy resin (e.g., of bisphenol A type) composition with (B) filler containing 10-90wt.% of spherical silica and (C) 0.5-10wt.% of a silicone compound (pref., silicone oil or silicone rubber carrying, as the functional group, amino group, epoxy group, carboxyl group, etc.).
|
