发明名称 Surface mounted array strain relief device
摘要 An electrical assembly having an integrated circuit package which has a plurality of electrical conductors fixed thereto. The electrical conductors form mechanical and electrical connections. Each of the electrical conductors has a root at one end and a tip at the other end. The root of each conductor is attached to the integrated circuit package to form a fixed electrical and mechanical connection. The tip of each conductor is adapted to be connected to a surface at a predetermined location. Each of the electrical conductors has at least two bends between the root and the tip for providing strain relief when the tip is connected to a surface.
申请公布号 US4764848(A) 申请公布日期 1988.08.16
申请号 US19860934297 申请日期 1986.11.24
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 SIMPSON, JOHN P.
分类号 H01R12/04;H05K1/02;H05K1/18;H05K3/34;(IPC1-7):H05K1/18 主分类号 H01R12/04
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