发明名称 |
Surface mounted array strain relief device |
摘要 |
An electrical assembly having an integrated circuit package which has a plurality of electrical conductors fixed thereto. The electrical conductors form mechanical and electrical connections. Each of the electrical conductors has a root at one end and a tip at the other end. The root of each conductor is attached to the integrated circuit package to form a fixed electrical and mechanical connection. The tip of each conductor is adapted to be connected to a surface at a predetermined location. Each of the electrical conductors has at least two bends between the root and the tip for providing strain relief when the tip is connected to a surface.
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申请公布号 |
US4764848(A) |
申请公布日期 |
1988.08.16 |
申请号 |
US19860934297 |
申请日期 |
1986.11.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SIMPSON, JOHN P. |
分类号 |
H01R12/04;H05K1/02;H05K1/18;H05K3/34;(IPC1-7):H05K1/18 |
主分类号 |
H01R12/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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