| 摘要 |
PURPOSE:To prevent inner leads from generating irregularity, and obtain a semiconductor device without short-circuit failures, by spreading resin on the inner leads and between the inner leads. CONSTITUTION:A pilot pin 13 arranged on a prescribed position of a lead frame mounting bed 11 is inserted into the hole 12 of a lead frame 1, and positioned. A proper quantity of gel-state resin 10 is discharged from a nozzle, and bridge formation is made on inner leads 6 and between the inner leads 6. A chip 4 vacuum-sucked by a collet 15 is carried to a tab 3 and fixed. Baking treatment is performed to harden at the same time silver paste and fixing resin 10. Thereby, the inner leads 6 bridged by the fixing resin 10 are completely fixed, and irregularity never generates.
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