| 摘要 |
PURPOSE:To prevent an electrical short circuit with the edge of an LSI chip generated by the deformation of an inner lead by forming a protruding section between the bonding position of an inner lead section and an LSI and the edge section of the LSI chip. CONSTITUTION:An LSI chip 8 is housed into an LSI chip housing section 6 for an insulating film 1, and connecting bumps 9 for the chip 8 and the bonding positions of inner lead sections 3 are bonded. Protruding sections 4 are shaped among bonding positions with bumps 9 on the lower surfaces of the inner lead sections 3, the surface sides oppositely faced to the chip 8, and the end section of the chip 8. Accordingly, even when the inner lead sections 3 are deformed, the noses of the protruding sections 4 collide with the surface of the chip 8, thus preventing contacts among the inner lead sections 3 and the edge of the chip 8.
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