发明名称 |
Photosensitive polymer composition, method for forming relief patterns, and electronic parts |
摘要 |
Disclosed are a photosensitive polymer composition comprising (a) a polymer soluble in an aqueous alkaline solution, (b) an o-quinonediazide compound, and (c) a dissolution inhibitor for the component (a) in an aqueous alkaline solution; a method of using the composition for forming relief patterns; and electronic parts having, as a passivating film or an interlayer insulating film, the relief pattern as formed in the method. The composition has high sensitivity, and give fine relief patterns having a good profile.
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申请公布号 |
US6365306(B2) |
申请公布日期 |
2002.04.02 |
申请号 |
US20010776925 |
申请日期 |
2001.02.06 |
申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C.;HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. |
发明人 |
NUNOMURA MASATAKA;YAMAZAKI NORIYUKI |
分类号 |
H01L21/312;C08K5/28;C08L79/04;C08L79/08;G03F7/004;G03F7/022;G03F7/023;G03F7/037;G03F7/039;(IPC1-7):G03F7/023;G03C3/00 |
主分类号 |
H01L21/312 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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