发明名称 TIMEPIECE PACKAGE STRUCTURE
摘要 PURPOSE:To simplify the structure of a timepiece, to reduce the cost of manufacture, and to stabilize the quality by connecting circuit wiring of a conductor directly to a base plate made of plastic which is the base of a timepiece, and joining elements on the circuit wiring. CONSTITUTION:An integrated circuit (IC) 3 is mounted by soldering on the circuit wiring 2 of the conductor laid on the plastic base plate 1 and connected electrically to the circuit wiring 2, the base plate 1 and integrated circuit 3 are reinforced and fixed, and the lead wire 8 of a crystal unit 7 and the circuit wiring 2 are mounted 4 by soldering. In this case, a copper lined substrate 13 in conventional structure is eliminated and the circuit wiring 2 of the conductor is laid on the plastic base plate 1 to solder the lead wire 8 linearly; while the crystal unit 7 is put close the reverse side 14 of a timepiece movement 14. Consequently, the thickness H of the conventional timepiece movement can be reduced by DELTAh, the manufacture cost is reduced, and the quality is improved.
申请公布号 JPS63175793(A) 申请公布日期 1988.07.20
申请号 JP19870007548 申请日期 1987.01.16
申请人 SEIKO INSTR & ELECTRONICS LTD 发明人 KIDA TEPPEI
分类号 G04C3/14;G04C3/00 主分类号 G04C3/14
代理机构 代理人
主权项
地址