发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATES |
摘要 |
A method of manufacturing a semiconductor substrate comprises a first step of preparing one hundred silicon bodies each having two silicon wafers held together by cohesion after polishing and heating processes. The method further comprises a second step of stacking the silicon bodies in their thickness direction to form a stacked body, and a third step of cylindrically grinding the side surface of the stacked body by a predetermined amount. |
申请公布号 |
EP0226772(A3) |
申请公布日期 |
1988.07.06 |
申请号 |
EP19860115342 |
申请日期 |
1986.11.05 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
NOMURA, TAKEHIKO C/O PATENT DIVISION;NATSUME, YOSHINORI C/O PATENT DIVISION;HOSOKI, YOSHINORI C/O PATENT DIVISION |
分类号 |
B24B9/06;H01L21/02;H01L21/18;H01L21/20;H01L21/208;H01L21/304;H01L29/06;(IPC1-7):H01L21/18 |
主分类号 |
B24B9/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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