In an IC card according to the present invention, a base sheet formed of thermoplastic material is sandwiched between a substrate sheet and a dummy sheet both formed of nonplastic material lower in thermoplasticity than the base sheet. The substrate sheet is fitted with at least one IC chip and input/output terminals electrically connected to the IC chip. First and second cover sheets formed of thermoplastic material are put individually on the outer surfaces of the substrate sheet and the dummy sheet. The cover sheet on the substrate sheet is formed with apertures through which the input/output terminals are exposed to the outside.
申请公布号
US4754319(A)
申请公布日期
1988.06.28
申请号
US19870097338
申请日期
1987.09.11
申请人
KABUSHIKI KAISHA TOSHIBA;SHOEI PRINTING COMPANY LIMITED