| 摘要 |
PURPOSE:To prevent the corrosion at a connection part and thus enhance the reliability by improving the moisture resistance by forming an insulation film which covers the surface of the connection part between a semiconductor chip and a bonding wire. CONSTITUTION:The semiconductor chip 2 is mounted on the island part 1 of a lead frame, and a bonding pad 4 is connected to the lead 3 by means of the metallic bonding wire 5. The oxide film 8 which covers the surface of the junction between the bonding pad 4 and the bonding wire 5 is formed by performing vapor treatment. Since the surface of the junction is coated with the oxide film 8, Al constituent inside is protected from the corroding action due to halogen ions such as Cl<->. Therefore, the generation of contact failure due to corrosion can be prevented even in the test of moisture resistance. |
