| 摘要 |
PURPOSE:To improve adhesive force of polyimide itself and that of polyimide to metal so as to form a multilayer film comprising polyimide resin film of low thermal expansion, by reforming a surface of polyimide by an etching technique. CONSTITUTION:A metal layer 19 or a resin layer 20 is formed on a polyimide resin film 18 of 3X10<-5>/K or less in thermal expansion coefficient. Then, a carbonyl compound film is formed on the resin film 18 by an etching process, and the metal layer 19 or the resin layer 20 is laminated on the carbonyl compound film. A surface of polyimide is activated by an etching technique so that a reaction of carbonyl compound is caused to induce a hydrogen bond between thin film molecules formed in an upper layer. Thus, carbonyl compound with adhesiveness can be formed on the surface of polyimide, and so a multilayer film comprising a polyimide resin film of low thermal expansion can be formed. |
