| 摘要 |
PURPOSE:To perform back grinding of a compound semiconductor wafer without after treatment such as cleaning, etc. by constituting a resin bond diamond wheel having flexural elastic modulas of 10-15X10<4>kgf/cm<2> of diamond abrasive grain, filler and bonding agent being resin. CONSTITUTION:Compound semiconductor wafer 1 is absorbed, with the surface down, with vacuum to a chuck table 2 and rotated by a motor 4 through an index table 3 and ground of the back by a ring-shaped abrasive grain layer 13 at the lower face of a cup type grindstone 6 rotating by stone axis 7. This abrasive grain layer 13 constitutes a resin bond diamond wheel having flexural elastic modulas of 10-15X10<4>kgf/cm<2> by diamond grains, filler consisting of alumina, calcium carbonate, silicon carbide and so on and bonding agent consisting of resin. In this way, the back grinding of a compound semiconductor wafer can be executed with the diamond wheel and processing time becomes shorter and after treatment such as cleaning, etc. becomes needless and processing affected layer becomes small and waste fluid doesn't occur and there never happens such a case as will damage clean environment.
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