| 摘要 |
PURPOSE:To obtain a semiconductor device having stable airtightness in a short time regardless of a material by arranging films having thickness of half or more of the thickness of a thermal-weldable frame onto both surfaces of the frame and pressure-bonding tabular molded forms and the frame and tabular molded form themselves. CONSTITUTION:Films having thickness of half or more of the thickness of a thermal-weldable frame are disposed onto both surfaces of the lead frame, on which an element consisting of semiconductors is mounted, and a tabular molded form having a space in which the semiconductors are stored and composed of a pair of a thermoplastic resin, a thermo-setting resin or ceramics is pressure-bonded onto at least one of the films. A resin such as polyamide, polyacetal, polycarbonate, etc., and a compound in which glass fiber and other fillers are added to these resins, and the like are preferable as the thermoplastic resin as the material of the tabular molded form. Ceramics containing one kind or several kinds of elements such as aluminum, silicon, boron, magnesium, etc., are desirable. Any kinds of materials having small moisture permeable quantity and heat-resisting properties may be employed as the thermal-weldable films.
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