| 摘要 |
PURPOSE:To shorten a bonding wire and, at the same time, to enhance the cooling efficiency of a light-emitting device by a method wherein a spacer composed of a material with excellent thermal conductivity is installed between the light-emitting device and a substrate while a connecting terminal of the light-emitting device is situated at the same height as the connecting terminal for an integrated circuit for driving the light-emitting device. CONSTITUTION:A light-emitting diode 13 is mounted on an AlN ceramic substrate 11 via a diamond-made spacer 12, and an integrated circuit 14 for driving the light-emitting device is mounted directly on the substrate 11. The shape of this light-emitting device 13 is an almost rectangular parallelepiped, and the shape of the integrated circuit 14 for driving the light-emitting device is also an almost rectangular parallelepiped. As the spacer 12 which is used to mount the light-emitting device 13, a diamond chip is used. At this kind of circuit, it is possible to shorten the effective length of a bonding wire 15 which connects the light-emitting device 13 to the integrated circuit 14 for driving the light-emitting device. |
