| 摘要 |
PURPOSE:To improve heat dissipation ability and work efficiency, and to enable formation of a multiple pin type in manufacture of a semiconductor device by a method wherein a chip is fixed on a heat dissipating plate, pads and connecting parts are connected directly, and the peripheral part of the heat dissipating plate and a substrate are fixed as to seal in the chip. CONSTITUTION:A chip 2 is fixed to a heat dissipating plate 1 using a low melting point solder material such as Au-Si or solder, etc. Then connecting parts 5 corresponding to chip pads 4, and a wiring pattern 6 to extend radially toward the outside periphery from the connecting parts 5 thereof are formed according to a thin film material such as Cr-Cu on a transparent wiring substrate 3 like a glass plate. The connecting parts 5 of the transparent wiring substrate 3 thereof and the pads 4 of the chip 2 fixed to the heat dissipating plate 1 are positioned, and connected by performing heating. At the same time with connection thereof, by glazing low melting point glass to the contact part of the heat dissipating plate 1 and the transparent substrate 3, bonding and sealing can be attained at the same time. Moreover, resin is favorably used for the sealing material thereof. |
