| 摘要 |
PURPOSE:To obtain an adhesive which has excellent stability at ordinary temperature and maintains a uniform and stable semihardened state, by compounding a thermosetting epoxy resin composition, a specified thermosetting epoxymethacrylate resin composition, a filler, and a thixotropic agent so that it has a specified viscosity. CONSTITUTION:A thermosetting epoxy resin composition is mixed with a thermosetting epoxymethacrylate resin composition which does not cure or hardly cures when heated at the curing temperature of the former composition, but cures when heated at a temperature higher than that. This mixture is mixed with a filler and a thixotropic agent to give an adhesive composition having a viscosity at 25 deg.C under a rate of shear of 1sec<-1> with a Brookfield viscometer of 200-500 P and a thixotropy index, defined as (a viscosity under a rate of shear of 1sec<-1>)/(a viscosity under a rate of shear of 100sec<-1>) with a Brookfield B viscometer, of 10-60.
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