| 摘要 |
An IC connector for an IC package having a plurality of vertically extending J bend type lead wires arranged in parallel rows along the side surfaces of the IC package main body, each lead wire having a vertical portion and a bent portion at each end thereof extending into the package main body. The connector has a plurality of contacts in spaced opposed parallel rows along the inner sides of the opposite side walls of an accommodating recess in the connector main body, each contact having a first elastic contacting piece extending upwardly and then inwardly and upwardly in the accommodating recess and being resiliently movable toward and away from the corresponding side wall for, when an IC package is inserted into the connector, engaging with a corresponding lead wire at the bent portion which is at the upper end of the vertical portion for exerting an inward and downward force on the lead wire, and a second elastic contacting piece having a first part spaced inwardly in the accommodation recess and being resiliently movable toward and away from the corresponding side wall independently of the first elastic contacting piece for, when an IC package is inserted into the connector, engaging with the same lead wire as the first elastic contacting piece.
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