| 摘要 |
<p>A semiconductor die attach system (10) adapted for attaching a semiconductor die (12) to a substrate (14). A metallic buffer component (16) is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder (18). The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive (19).</p> |
