| 摘要 |
PURPOSE:To relieve concentration of stress and avoid development of crackings into the molding resin of a resin molded semiconductor device by providing beveled parts at the corners of a semiconductor chip. CONSTITUTION:Beveled parts 15 are provided at the corners 11 of a semiconductor chip 7 where the top surface 13 which is an element forming surface meets the side surfaces 14 and the semiconductor chip 7 of this form is molded with resin to constitute a semiconductor device 10. The beveled parts 15 of the semiconductor chip 7 can be formed by, for instance, wet etching or mechanical cutting. With this constitution, as the beveled parts 15 are provided at the corners 11 of the semiconductor chip 7 to form obtuse angles, the concentration of stress can be relieved compared with the conventional right angle corners 11. Therefore, development of crackings 12 at the time of and after the resin molding can be avoided.
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