发明名称 MAGNETRON SPUTTERING DEVICE
摘要 PURPOSE:To form a thin film having excellent quality by sputtering on the surface of a work by providing coil to the outer peripheral face of a vacuum vessel of a magnetron sputtering device disposed with the work between two targets in the vacuum vessel. CONSTITUTION:A rotatable substrate 9 to be treated is supported by a supporting body 10 in the vacuum vessel 1 of the magnetron sputtering device. The targets 3, 4 mounted with electromagnets 5, 6 on the rear surface are disposed above and below the substrate. The inside of the vessel 1 is evacuated to a vacuum and a sputtering gas consisting of a gaseous mixture composed of gaseous Ar and gaseous O2 is introduced into the vessel. The coils 41, 42 provided on the outer peripheral face of the vessel 1 are energized to apply perpendicular magnetic fields to the targets 3, 4; thereafter, glow discharge is generated between the targets 3, 4 and a shutter 12 by high-voltage power supplies 13, 14 to clean the surfaces of the targets 3, 4. The electromagnets 5, 6 are successively energized to open the shutter 12 and the targets 3, 4 are sputtered by the ionized gaseous Ar, by which the clean thin film having the high quality is formed on the substrate 9.
申请公布号 JPS63103067(A) 申请公布日期 1988.05.07
申请号 JP19860250270 申请日期 1986.10.20
申请人 FUJITSU LTD 发明人 KANDA HIDEKAZU;SHINOHARA MASAKI;WAKAMATSU HIROAKI;KIUCHI KATSUMI;KUME TOMIO
分类号 C23C14/36;C23C14/35 主分类号 C23C14/36
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